Arup's Tall Buildings in Asia: Stories Behind the Storeys

Arup's Tall Buildings in Asia: Stories Behind the Storeys

Arup: Ho, Goman Wai Ming

See other items by same author: Arup: Ho, Goman Wai Ming

See other items by same publisher: Taylor & Francis Ltd


  • ISBN
  • Format
  • Language
  • Pages
  • Publisher
  • Date Published
  • Shipping notice
  • 9781138058736
  • Hardback
  • English
  • 192
  • Taylor & Francis Ltd
  • Oct 2017
  • Available to order but dispatch within 5-10 days
Through a series of detailed case studies from East Asia, Arup, one of the global leaders in tall building design, presents the latest developments in the field to inspire more innovative and sustainable ideas in tall building design and engineering.

This book exhibits the key design aspects of tall buildings in 20 case studies, from China, Singapore, Hong Kong, Vietnam and Japan. Chapters cover design and construction, safety concerns, sustainability strategies, BIM and optimisation solutions, and include contributions from the actual project engineers. The projects chosen are not the tallest buildings, but all of them have been selected for their significant engineering insights and values. Arup's engineers explain the design principles, and how they overcame various design constraints and challenges, while exceeding their clients' expectations.

Unique examples include:

the design and application of a hybrid outrigger system in the Raffles City Chongqing project

the challenges encountered in the construction of the CCTV Headquarters, Beijing

as well as Tianjin's Goldin Finance 117 Tower, Ho Chi Minh City's Vincom Landmark 81, the China Resources Headquarters, Ping An IFC, Tokyo's Nicolas G Hayek Center and the Shanghai World Financial Centre.
These varied and complex cases studies draw on multi-disciplinary design and engineering challenges which make this book essential reading for architects, structural engineers, project managers and researchers of high-rise buildings. The book also provides a usual reference and link between practitioners in the industry, academia and engineering students.